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Engineers and buyers in fields such as precision optics, semiconductors, and laser systems often require materials with extremely low thermal expansion coefficients for their equipment components. Low-expansion glass can minimize thermal deformation and maintain dimensional stability. Today, I’ll compare the five most commonly used low-expansion materials—Zerodur, ULE, ClearCeram (glass-ceramic), BF33 (Borofloat 33), and Fused Silica—to

Porous ceramic chucks are a type of vacuum chuck that uses micron/submicron interconnected channels to achieve uniform negative pressure adsorption. Compared to traditional grooved or perforated metal chucks, porous ceramics can provide uniform adsorption across the entire surface without localized depressions, greatly reducing the deformation and localized stress caused by thin wafers/wafers being “sucked into

In the semiconductor industry, Aluminum Nitride (AlN) and Silicon Carbide (SiC) have long been widely used due to their unique properties. This article compares AlN and SiC based on their characteristics and applications in the semiconductor field, helping you select the most suitable material. 1.Thermal Conductivity Semiconductor devices generate significant heat during operation, requiring high

Definition of Fused Quartz Fused Quartz / Fused Silica is an amorphous glass obtained by melting and rapidly cooling high-purity silicon dioxide. It features an extremely low coefficient of thermal expansion, excellent optical transmission (covering UV–visible–infrared ranges), high thermal resistance, and strong chemical corrosion resistance. These properties make it a key material in demanding applications

在使用先进陶瓷时，制造方法的选择可以决定零件是否能满足其性能要求，或者在使用中是否会出现故障。陶瓷加工和激光切割是两种常见的方法。虽然这两种方法都广泛应用于工业领域，但它们在精度、表面质量、成本和复杂设计的适用性等方面存在很大差异。本指南比较了

了解材料选择、加工工艺、质量控制和供应商建议，为您的工业项目找到最佳解决方案。定制陶瓷部件（也称为原型）是根据客户图纸制造的精密部件。它们由氧化铝、氮化铝、碳化硅、Macor 等材料通过切割、研磨、抛光制成、

最近，我们为一家专门从事精密惯性导航系统的科研机构定制加工了一批 Zerodur 玻璃腔体组件。这些空腔用于激光陀螺仪的核心组件。Zerodur 因其超低的热膨胀系数和出色的光学性能，被广泛认为是高稳定性光学系统的关键材料。

碳化硅（SIC）是半导体制造领域的首选材料之一，因其高硬度、低热膨胀、超高刚度和优异的化学惰性，已成为半导体制造设备中承重和定位部件的关键部分，如（托盘板、晶圆卡盘、针状卡盘、环形卡盘、槽形卡盘、陶瓷针）。

在现代制造业中，技术的不断进步推动了对高性能材料需求的不断增长。航空航天、半导体、光学仪器、自动化和石油化工等行业对硬脆材料（如各种先进陶瓷和光学玻璃）的需求激增。原型制造和快速交付已成为该行业的主流趋势。光学玻璃材料（如

虽然玻璃陶瓷和先进陶瓷都属于无机非金属材料，但它们本质上是两种不同的材料。先进陶瓷由烧结粉末制成，其微观结构不均匀且本身多孔，这限制了其最终的机械和热性能。相比之下，玻璃陶瓷是一种复杂的工程材料。在超硬材料和