{"id":4762,"date":"2025-07-22T21:18:43","date_gmt":"2025-07-23T06:48:43","guid":{"rendered":"https:\/\/jundro.io\/?p=4762"},"modified":"2025-07-22T22:03:39","modified_gmt":"2025-07-23T07:33:39","slug":"application-of-sic-components-in-semiconductors-wafer-inspection-bonding-metrology-to-lithography","status":"publish","type":"post","link":"https:\/\/jundro.io\/zh\/sic-\u5143\u4ef6\u5728\u534a\u5bfc\u4f53\u6676\u7247\u68c0\u6d4b\u4e2d\u7684\u5e94\u7528-\u7c98\u5408\u8ba1\u91cf\u5b66\u5728\u5149\/","title":{"rendered":"SIC \u5143\u4ef6\u5728\u534a\u5bfc\u4f53\u4e2d\u7684\u5e94\u7528--\u6676\u5706\u68c0\u6d4b\u3001\u63a5\u5408\u3001\u5149\u523b\u8ba1\u91cf"},"content":{"rendered":"\t\t
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Silicon carbide (SIC)<\/a><\/span>, one of the preferred materials in semiconductor manufacturing, has become a key part of the load-bearing and positioning components in semiconductor manufacturing equipment due to its high hardness, low thermal expansion, ultra-high rigidity and excellent chemical inertness, such as (carrier tray plate, wafer chuck, needle chuck, ring chuck, slot chuck, ceramic needle chuck, wafer chuck table, etc.) to help the efficient and high-yield operation of detection, bonding, metrology and lithography processes<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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SiC Parts Advantages<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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  • Low thermal expansion coefficient: 4.0\u00d710\u207b\u2076\/K, well matched with silicon wafer (2.6\u00d710\u207b\u2076\/K)<\/li>
  • Ultra-high rigidity and wear resistance: close to the hardness of single crystal grinding wheel.<\/li>
  • Stable support of mechanical load after processing, long service life.<\/li>
  • Chemical inertness and clean compatibility: resistant to photoresist solvents and common chemical reagents<\/li>
  • Nanoscale super plane: surface flatness can reach \u22640.01\u20130.05\u03bcm, roughness Ra\u22640.3\u20131nm<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    SiC Core Parts<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    Component<\/td>\nPrimary Function<\/td>\nWafer Size<\/td>\nFlatness (Global)<\/td>\nSurface Roughness (Ra)<\/td>\nMachining Tolerance<\/td>\nVacuum Hole \/ Clamping Method<\/td>\n<\/tr>\n
    SiC Carrier Tray Plate<\/td>\nWafer storage and short-distance transfer<\/td>\n6\u2033 \/ 8\u2033 \/\u00a012\u2033<\/td>\n\u2264\u202f0.05\u202f\u03bcm<\/td>\n\u2264\u202f1\u202fnm<\/td>\n\u00b1\u202f5\u202f\u03bcm<\/td>\nOptional vacuum suction hole array<\/td>\n<\/tr>\n
    SiC Wafer Chuck<\/td>\nPlatform for lithography, inspection, bonding<\/td>\n12\u2033<\/td>\n\u2264\u202f0.02\u202f\u03bcm<\/td>\n\u2264\u202f0.5\u202fnm<\/td>\n\u00b1\u202f2\u202f\u03bcm<\/td>\nEvenly distributed vacuum holes<\/td>\n<\/tr>\n
    SiC Pin Chuck<\/td>\nPoint support for die or small wafers<\/td>\nCustom size<\/td>\n\u2264\u202f0.05\u202f\u03bcm<\/td>\n\u2264\u202f1\u202fnm<\/td>\nPin height \u00b1\u202f1\u202f\u03bcm<\/td>\nDual-mode: mechanical \/ vacuum<\/td>\n<\/tr>\n
    SiC Ring Chuck<\/td>\nSupport for ring-shaped or custom wafers<\/td>\nCustom diameter<\/td>\n\u2264\u202f0.03\u202f\u03bcm<\/td>\n\u2264\u202f0.8\u202fnm<\/td>\n\u00b1\u202f3\u202f\u03bcm<\/td>\nVacuum-sealed ring groove<\/td>\n<\/tr>\n
    SiC Groove Chuck<\/td>\nV\/U groove support for curved or odd-shaped wafers<\/td>\nCustom width<\/td>\n\u2264\u202f0.04\u202f\u03bcm<\/td>\n\u2264\u202f0.8\u202fnm<\/td>\nGroove width \u00b1\u202f2\u202f\u03bcm<\/td>\nVacuum channel at groove base<\/td>\n<\/tr>\n
    SiC Ceramic Needle Gripper<\/td>\nPrecision gripping of probes or micro parts<\/td>\n\u2014<\/td>\nNeedle tip \u2264\u202f0.02\u202f\u03bcm<\/td>\n\u2264\u202f0.5\u202fnm<\/td>\nPin pitch \u00b1\u202f2\u202f\u03bcm<\/td>\nMechanical grip \/ optional vacuum<\/td>\n<\/tr>\n
    SiC Wafer Chuck Stage<\/td>\nHigh-precision XYZ motion and nano positioning<\/td>\n12\u2033<\/td>\n\u2264\u202f0.01\u202f\u03bcm (ultra-flat)<\/td>\n\u2264\u202f0.3\u202fnm<\/td>\nParallelism \u2264\u202f50\u202fnm<\/td>\nHybrid vacuum & mechanical clamping<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    Note: All parts can be customized according to customer requirements<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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    SiC Parts Application<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    • Wafer inspection equipment probe card fixture, carrier, carrier and transfer arm, etc.<\/li>
    • Bonding equipment hot press plate, thermocouple seat, etc.<\/li>
    • Measuring equipment turntable bearing seat, chuck, bracket, etc.<\/li>
    • Photolithography machine alignment table, aperture bracket, etc.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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      Semiconductor Ceramics Manufacturers<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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      As a specialized semiconductor ceramics manufacturer, we provide ultra-flat, high-purity silicon carbide (SiC) parts engineered for demanding processes \u2014 from wafer inspection, bonding, metrology to photolithography.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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