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As an ultra-low expansion glass, Zerodur is highly recognized by high-end manufacturing for its extremely low CTE coefficient and excellent dimensional stability, while lightweight Zerodur is used in advanced optical and aerospace systems, generally using hollow or honeycomb structure design, which can reduce weight by up to 70% without excessively sacrificing mechanical properties and optical

Zerodur zero-expansion glass-ceramic has long been recognized as an outstanding material in the industrial market, with well-established application areas. In the field of photolithography, it is widely used in critical components such as reticle blank substrates, lithography stage bases, and mirrors and frames in stepper alignment and positioning systems. Its thermal properties can be customized

In the semiconductor field, etching equipment is a critical process in semiconductor manufacturing. Common etching methods include dry etching, plasma etching, reactive ion etching, etc. In these etching equipment, some high temperature resistant, corrosion resistant, and insulating materials are usually used, such as ceramic materials (aluminum oxide (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), silicon

In current automotive, semiconductor, and aerospace applications, silicon carbide ceramics parts have been an indispensable material in harsh environments. Due to its high temperature resistance, wear resistance, and corrosion resistance, it maintains the stability and durability of equipment in harsh working conditions. Advantages of SiC ceramics parts ✅ High hardness and high bending strength ✅

Zerodur substrate is a glass-ceramic material with ultra-low thermal expansion coefficient and excellent mechanical stability. It is used in semiconductor die bonding, optical primary mirrors, measuring instruments, etc. Its core characteristic is a near-zero thermal expansion coefficient (CTE) (CTE≈0±0.05×10⁻⁶/K in the range of 0–50°C) (Click to view detailed information of zerodur) Zerodur Substrate Features Extreme

Aluminum nitride wafer carrier is a carrier used to transport wafers in semiconductor equipment (such as deposition, etching or heat treatment) steps. It can fix the wafer through electrostatic adsorption technology to prevent the wafer from warping and deformation. Common ones are general 12 inch 300mm AlN (Aluminum Nitride) Wafer Carrier size and customized AIN

Flip-Chip Bonder is a common semiconductor packaging equipment, its function is to flip the chip over and bond it directly to the substrate. SiC Vacuum Chucks are specially designed for flip chip bonding process, using vacuum pressure to firmly absorb the wafer or chip. Next, I will analyze its specific role. Role of SiC Vacuum

Among today’s wafer batch processing equipment, take centrotherm’s c.HORICOO300 as an example. This equipment is used by Renesas Electronics of Japan in its 300mm power semiconductor production line in Yamanashi Prefecture, mainly for oxidation and annealing processes. The system adopts an 8-tube cluster design and is equipped with a fully automatic wafer and wafer boat

Introduction In today’s industrial environment, electrical insulating ceramic materials are often used to protect various precision instruments and are widely used in engineering applications such as semiconductors and aerospace. In addition to high electrical insulation, ceramic materials also have excellent properties such as high thermal conductivity and high mechanical strength. Below I will list 5

In the modern precision optical field, the selection of low thermal expansion materials is particularly critical, such as the lenses of large optical telescopes and the optical components of laser gyroscopes. Zerodur or ULE Glass are both famous for their extremely low thermal expansion coefficients. So how do you choose which material to use as