Fused Silica Glass

Very low coefficient of thermal expansion (approximately 0.5 × 10⁻⁶ /°C)

Fused-Silica-Glass
MaterialFused Silica Glass
Density2.20 g/cm³
RoughnessRa0.002μm
Maximum sizeф500*50mm

Introduction

Fused Silica Glass is widely used in high-tech fields such as semiconductors, optics, and scientific research due to its excellent physical and chemical properties. It is composed of amorphous materials of high-purity silicon dioxide SiO₂ (>99.9%), which does not contain other oxides and avoids impurities. At the same time, Fused Silica has strong resistance to acids, alkalis and most corrosive substances, and is suitable for extreme chemical environments. The following is a detailed introduction to its characteristics and applications.

Fused Silica Glass Advantages

✅ High purity >99.9% SiO₂

✅ Extremely low thermal expansion coefficient (0.5 × 10⁻⁶ /°C) and strong thermal shock resistance

✅ High resistivity

✅ Strong resistance to chemicals

✅ High transmittance from deep ultraviolet to infrared (175 nm ~ 2500 nm), suitable for optical applications

✅ High mechanical strength, precision polishable surface

Application

✅ Photolithography masks, photolithography machine lenses, wafer carriers, heat treatment boats, cavity windows

✅ Ultraviolet lenses, laser windows, reflector substrates

✅ Infrared/ultraviolet windows, high-speed aircraft windows

✅ Quartz cuvettes, laser cavity lenses

✅ Optical path components for spectrometers and chromatographs

✅ High-temperature gas sensor windows

✅ Microstructure devices, optical trap structures, vacuum cavity windows

✅ Interferometers, gyroscope substrates

Fused Silica Glass Properties

Material Properties

PropertyUnitFused Silica Glass
Densityg/cm³2.2
Bending StrengthMPa80
Compressive StrengthMPa1100
Elastic ModulusGPa220
Poisson’s Ratio0.17
Young’s ModulusGPa72

Thermal Properties

Property Unit Fused Silica Glass
Thermal Conductivity W/m·K 1.38
Melting Point °C 1730
Maximum Operating Temperature °C 1200
Linear Expansion Coefficient 10⁻⁶/K 0.55

Electrical Properties

Property Unit Fused Silica Glass
Dielectric Constant 1 MHz 3.75
Breakdown Voltage V/cm 400
Dielectric Loss 1 MHz < 0.0004
Resistivity Ω·cm > 10¹⁸

Fused Silica Glass Machining

Fused Silica Glass Manufacturer

High-Purity Fused Silica Glass Manufacturer & Precision Machining Expert
We are a professional manufacturer of high-purity fused silica glass, offering integrated services from material supply to precision CNC machining. With advanced 3-axis, 4-axis, and 5-axis machining capabilities, we produce custom components with ultra-tight tolerances (±0.001 mm), optical-grade polishing (up to 1/20λ), and complex geometries.

 

Our fused silica parts are widely used in semiconductors, optics, aerospace, analytical instruments, and scientific research. Backed by ISO 9001 and ISO 14001 certifications, we ensure stable quality, fast delivery, and technical support tailored to your critical applications.

 

FAQ

Yes. Although fused silica is extremely hard and brittle, we use multi-axis CNC machines (3, 4 and 5 axes), diamond tools and our extensive experience to achieve tight tolerances (± 0.001 mm), fine apertures (down to Ø 0.1 mm) and polished optical surfaces (Ra 0.002 microns).

Technically, fused silica is a type of quartz glass made from high-purity silicon dioxide (SiO₂), but with lower metallic impurities and better optical performance. Fused silica offers superior thermal stability, lower thermal expansion (0.55 × 10⁻⁶/K), and high UV transparency, making it ideal for critical optical and semiconductor applications.

 

Fused silica parts are widely used in UV optics, semiconductor wafer handling, laser windows, aerospace sensors, and scientific instruments. Its excellent thermal shock resistance and high-purity structure make it suitable for harsh and high-temperature environments (up to 1200°C continuous use).

We specialize in custom fabrication based on customer drawings or specifications. Whether it’s a prototype or volume production, we offer end-to-end support including material selection, design optimization, CNC machining, polishing, cleaning, and packaging.

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