Application of SIC components in semiconductors—wafer inspection, bonding, metrology to lithography

Silicon carbide (SIC), one of the preferred materials in semiconductor manufacturing, has become a key part of the load-bearing and positioning components in semiconductor manufacturing equipment due to its high hardness, low thermal expansion, ultra-high rigidity and excellent chemical inertness, such as (carrier tray plate, wafer chuck, needle chuck, ring chuck, slot chuck, ceramic needle chuck, wafer chuck table, etc.) to help the efficient and high-yield operation of detection, bonding, metrology and lithography processes

SiC Parts Advantages

Low thermal expansion coefficient: 4.0×10⁻⁶/K, well matched with silicon wafer (2.6×10⁻⁶/K)
Ultra-high rigidity and wear resistance: close to the hardness of single crystal grinding wheel.
Stable support of mechanical load after processing, long service life.
Chemical inertness and clean compatibility: resistant to photoresist solvents and common chemical reagents
Nanoscale super plane: surface flatness can reach ≤0.01–0.05μm, roughness Ra≤0.3–1nm

SiC Core Parts

组件	Primary Function	Wafer Size	Flatness (Global)	Surface Roughness (Ra)	Machining Tolerance	Vacuum Hole / Clamping Method
SiC Carrier Tray Plate	Wafer storage and short-distance transfer	6″ / 8″ / 12″	≤ 0.05 μm	≤ 1 nm	± 5 μm	Optional vacuum suction hole array
SiC Wafer Chuck	Platform for lithography, inspection, bonding	12″	≤ 0.02 μm	≤ 0.5 nm	± 2 μm	Evenly distributed vacuum holes
SiC Pin Chuck	Point support for die or small wafers	Custom size	≤ 0.05 μm	≤ 1 nm	Pin height ± 1 μm	Dual-mode: mechanical / vacuum
SiC Ring Chuck	Support for ring-shaped or custom wafers	Custom diameter	≤ 0.03 μm	≤ 0.8 nm	± 3 μm	Vacuum-sealed ring groove
SiC Groove Chuck	V/U groove support for curved or odd-shaped wafers	Custom width	≤ 0.04 μm	≤ 0.8 nm	Groove width ± 2 μm	Vacuum channel at groove base
SiC Ceramic Needle Gripper	Precision gripping of probes or micro parts	-	Needle tip ≤ 0.02 μm	≤ 0.5 nm	Pin pitch ± 2 μm	Mechanical grip / optional vacuum
SiC Wafer Chuck Stage	High-precision XYZ motion and nano positioning	12″	≤ 0.01 μm (ultra-flat)	≤ 0.3 nm	Parallelism ≤ 50 nm	Hybrid vacuum & mechanical clamping

Note: All parts can be customized according to customer requirements

SiC Parts Application

Wafer inspection equipment probe card fixture, carrier, carrier and transfer arm, etc.
Bonding equipment hot press plate, thermocouple seat, etc.
Measuring equipment turntable bearing seat, chuck, bracket, etc.
Photolithography machine alignment table, aperture bracket, etc.

Semiconductor Ceramics Manufacturers

As a specialized semiconductor ceramics manufacturer, we provide ultra-flat, high-purity silicon carbide (SiC) parts engineered for demanding processes — from wafer inspection, bonding, metrology to photolithography.