SIC Ceramic Chuck
High hardness, high thermal conductivity, low thermal expansion coefficient
Silicon Carbide Ceramic Chuck is usually used for vacuum adsorption, electrostatic adsorption or mechanical clamping of wafers
Product | SlC Ceramic Chuck |
Material | Silicon carbide |
size | Φ310*20 |
SIC Ceramic Advantages
✅ Extremely low thermal expansion coefficient
✅ High thermal conductivity of 120–200 W/m·K
✅ Mohs hardness of 9.2, second only to diamond and cubic boron nitride
✅ Excellent chemical stability, suitable for cleanroom and vacuum chamber environments
✅ Surface can be processed by high-precision grinding and polishing
Applications
✅ Semiconductor wafer processing (e.g., CVD, etching, CMP)
✅ Optical glass processing and inspection
✅ Micromachining platform
✅ Laser processing platform
✅ Ultra-precision machining and measurement systems
Customizable Machining Services
High-performance SiC ceramic chucks place extremely high demands on manufacturers’ material control and precision machining capabilities. Our company boasts:
5-axis CNC equipment and ultra-precision polishing equipment
Surface finish accuracy reaches Ra 0.005 μm, with a flatness of < 1 μm
We provide a one-stop solution from structural design, finishing, to surface polishing.
Whether it’s custom-shaped fixtures or other parts, we offer stable and reliable SiC ceramic machining services.
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