Semiconductor SiC Electrostatic Chuck

Used for wafer fixation during etching, deposition or CMP processes

The semiconductor silicon carbide electrostatic chuck (ESC) is a component commonly used in etching, deposition or CMP. It uses Coulomb force or Johnson-Rabec effect to firmly fix the wafer without the need for additional mechanical clamps. At the same time, the ESC made of SiC has super high durability in corrosion and plasma environments.

SiC ESC Case

electrostatic chuck

Performance

✅ Ultra-high thermal conductivity can improve the process accuracy of etching or deposition

✅ Strong resistance to corrosive gases

✅ Excellent high temperature stability, able to maintain structural stability at high temperatures

✅ High hardness and wear resistance, no wear or particle contamination during long-term use

✅ SiC Electrostatic Chuck has high resistivity and meets the characteristics of electrostatic adsorption

Applications

✅ Plasma etching

Ion implantation

Chemical vapor deposition/physical vapor deposition

Photolithography

What we can do

We are a professional manufacturer of ultra-hard materials, providing diversified and customized components for the semiconductor industry, such as (vacuum chuck, wafer support platform, End Effector, Wafer Handling Robot Arm and other ceramic components). We have professional five-axis processing equipment and rich experience, and can process package components with heterogeneous, circular and curved surfaces. All tolerances can be improved according to actual size and shape to perfectly match your equipment and specific needs.

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