NEXCERA ultra-low expansion ceramic

Q: How does NEXCERA™ compare to other low thermal expansion materials?

Compared to materials like Zerodur® or ULE® glass, NEXCERA™ offers: Higher stiffness : Enhancing structural rigidity. Better machinability : Facilitating the production of complex shapes. Superior aging stability : Maintaining dimensions over extended periods. Lower thermal expansion near room temperature : Providing greater thermal stability.

Q: How to choose a NEXCERA™ model?

Model selection should be based on specific application requirements: High-strength scenarios: select CD107 (bending strength 230 MPa) or N117B (strength 230 MPa); Thermal conductivity priority: select CD107 (thermal conductivity 4.7 W/mK); Economy and versatility: select N113B (thermal expansion coefficient <0.03×10⁻⁶/℃, balanced overall performance)

Q: Is NEXCERA™ suitable for use in high temperature or chemically aggressive environments?

NEXCERA™ is suitable for high temperature or chemical corrosion environments, because Thermal stability: thermal conductivity 3.7–4.7 W/mK (better than ZERODUR’s 1.46 W/mK), can quickly and evenly dissipate heat and reduce thermal stress; Corrosion resistance: non-porous structure and high chemical inertness, resistant to acid, alkali and plasma environments, suitable for semiconductor manufacturing and high-temperature furnaces; Long-term stability: dimensional change within 13 months is only 0.01±0.01 ppm, no creep aging problem

Q: How to achieve NEXCERA™ nano-level surface roughness? Is it difficult to process complex shapes?

NEXCERA™’s non-porous structure supports precision machining: Surface treatment: Through technologies such as magnetorheological finishing (MRF), the surface roughness can reach <1 nm RMS, meeting the requirements of optical mirrors; Complex molding: Using near-net-shape sintering technology, parts close to the final shape can be directly manufactured, reducing the amount of subsequent processing. A typical example is JAXA’s 1.8-meter diameter ultra-lightweight mirror substrate, which achieves a closed back structure through diffusion welding (HIP), greatly reducing processing costs.

NEXCERA is an ultra-low expansion ceramic developed by Krosaki Harima Corporation. Its thermal expansion coefficient is about 0 ±0.02 x10⁻⁶/K (in the range of 20–300°C), which is comparable to glass ceramics such as Zerodur and ULE. It is often used in semiconductors, optical benchmarks, precision measurement and other fields.

NEXCERA Advantages

Ultra-low thermal expansion coefficient, CTE is less than 0.03×10⁻⁶/℃ at room temperature, close to zero expansion
High rigidity and lightweight, better than glass materials
Non-porous structure, can be polished to a mirror surface
Supports complex shape machining
Resistant to chemical corrosion, suitable for use in harsh environments
Maintains dimensional stability under temperature changes

NEXCERA Application

Three-dimensional coordinate measuring machine aperture plate
Space telescope mirror substrate
High-precision reflector
Alignment platform
Electrostatic chuck, electric vacuum chuck
Optical resonator
Ultra-stable optical cavity gasket

Data Sheet

Model	Density (g/cm³)	Flexural Strength (MPa)	Young’s Modulus (GPa)	Specific Stiffness (GPa·cm³/g)	Fracture Toughness (MPa·m^0.5)	Hardness (GPa)
N113B	2.5	210	130	52	1.2	8
N117B	2.55	230	140	55	1.2	8.1
N118C	2.58	220	140	54	1.4	8.1
N119C	2.5	166	130	52	1.3	8
CD107	2.57	230	143	55	1.4	–
Thermal and Electrical Properties
Model	Thermal Expansion Coefficient (×10⁻⁶/K)	Thermal Conductivity (W/m·K)	Dielectric Constant (1 MHz)
N113B	< 0.03	3.7	4.7
N117B	< 0.03	4.2	6
N118C	< 0.05	4.5	4.7
N119C	< 0.05	4.3	4.4
CD107	< 0.03 (at 22°C)	4.7	4.6

Note: The above values are representative and not guaranteed. These figures are sourced from Krosaki Harima Corporation’s official product data.

NEXCERA Manufacturer

We are committed to manufacturing and providing a variety of ultra-hard materials for semiconductor, electronics, aerospace, defense, optics and related industries. Including NEXCERA substrate / block / mirror blank and other high-performance ceramic materials. We have five-axis machining equipment and have the ability to machine complex structures such as anisotropy, circles, and curved surfaces. All tolerances can be improved according to the size and shape of the drawing to perfectly fit your equipment needs.

Frequently Asked Questions

How does NEXCERA™ compare to other low thermal expansion materials?

Compared to materials like Zerodur® or ULE® glass, NEXCERA™ offers:

Higher stiffness: Enhancing structural rigidity.
Better machinability: Facilitating the production of complex shapes.
Superior aging stability: Maintaining dimensions over extended periods.
Lower thermal expansion near room temperature: Providing greater thermal stability.

How to choose a NEXCERA™ model?

Model selection should be based on specific application requirements:

High-strength scenarios: select CD107 (bending strength 230 MPa) or N117B (strength 230 MPa);
Thermal conductivity priority: select CD107 (thermal conductivity 4.7 W/mK);
Economy and versatility: select N113B (thermal expansion coefficient <0.03×10⁻⁶/℃, balanced overall performance)

Is NEXCERA™ suitable for use in high temperature or chemically aggressive environments?

NEXCERA™ is suitable for high temperature or chemical corrosion environments, because

Thermal stability: thermal conductivity 3.7–4.7 W/mK (better than ZERODUR’s 1.46 W/mK), can quickly and evenly dissipate heat and reduce thermal stress;

Corrosion resistance: non-porous structure and high chemical inertness, resistant to acid, alkali and plasma environments, suitable for semiconductor manufacturing and high-temperature furnaces;

Long-term stability: dimensional change within 13 months is only 0.01±0.01 ppm, no creep aging problem

How to achieve NEXCERA™ nano-level surface roughness? Is it difficult to process complex shapes?

NEXCERA™’s non-porous structure supports precision machining:

Surface treatment: Through technologies such as magnetorheological finishing (MRF), the surface roughness can reach <1 nm RMS, meeting the requirements of optical mirrors;

Complex molding: Using near-net-shape sintering technology, parts close to the final shape can be directly manufactured, reducing the amount of subsequent processing.
A typical example is JAXA’s 1.8-meter diameter ultra-lightweight mirror substrate, which achieves a closed back structure through diffusion welding (HIP), greatly reducing processing costs.