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In semiconductor manufacturing, precision, purity, and durability are everything. Among the many advanced materials supporting this industry, fused quartz glass (fused silica) stands out for its unique combination of high purity, optical transparency, thermal stability, and plasma resistance. These properties make it indispensable across nearly every stage of wafer processing. Let’s take a quick tour

In precision industrial systems, electrical insulation and dimensional stability are non-negotiable. As industries like semiconductors, aerospace, optics, and vacuum technology push performance limits, engineers increasingly turn to Macor machinable glass ceramic — a material that combines the reliability of ceramics with the flexibility of machining. So, why is Macor the go-to choice for insulation components

Want a fiber alignment that’s “plug once, stay aligned for years”? Zirconia (ZrO₂) V-grooves combine material strength and precision machining to solve alignment and durability headaches.Fuse zirconia strength and thermal stability into V-groove fiber alignment: materials, groove angles, micron tolerances and polishing workflows for long-term reliability. Why choose zirconia for V-grooves? Higher strength & impact

If you’re an engineer who frequently uses ceramic materials for equipment components, you’ve likely come across zirconium oxide (ZrO₂), a material renowned for its exceptional strength, wear resistance, and thermal stability. However, not all zirconium oxide is created equal. Zirconia not only differs in color (black, blue, and white), but also in yttria-stabilized zirconia (YSZ)

When selecting advanced ceramic materials for precision equipment components, two materials often stand out. Macor machinable glass-ceramic and Zirconium oxide (ZrO₂). Both materials have their uses in industries such as engineering, semiconductors, and medicine. This article compares the key properties, advantages, and typical applications of these two materials to help you select the right ceramic

What Is JGS1 Fused Silica? JGS1 Fused Silica is a UV-grade optical quartz material characterized by high purity, excellent UV transmittance (185–2500 nm), and superior thermal stability. It is one of the three grades defined by China’s GB/T 31447.1 standard for optical fused silica (JGS1, JGS2, JGS3). JGS1: UV-grade, best for deep-UV and precision optics.

In today’s materials industry, silicon carbide ceramics are undoubtedly the hardest and most durable ceramic material known. Due to its exceptional hardness (Mohs hardness 9.5), high thermal conductivity, and chemical resistance, it is frequently used in aerospace, semiconductor equipment, mechanical seals, and other fields. However, SiC machining is extremely difficult. Traditional techniques cannot achieve the

Leading aluminum nitride (AlN) ceramic manufacturers include CoorsTek, Kyocera, Tokuyama (SHAPAL™), MARUWA, and Jundro Ceramics Technology. These companies provide AlN substrates, heat sinks, and custom components widely used in semiconductors, power electronics, aerospace, and medical devices. AlN ceramics typically achieve thermal conductivity between 170–200 W/m·K, combined with excellent electrical insulation (>10¹³ Ω·cm) and high-temperature stability,

Engineers and buyers in fields such as precision optics, semiconductors, and laser systems often require materials with extremely low thermal expansion coefficients for their equipment components. Low-expansion glass can minimize thermal deformation and maintain dimensional stability. Today, I’ll compare the five most commonly used low-expansion materials—Zerodur, ULE, ClearCeram (glass-ceramic), BF33 (Borofloat 33), and Fused Silica—to

Porous ceramic chucks are a type of vacuum chuck that uses micron/submicron interconnected channels to achieve uniform negative pressure adsorption. Compared to traditional grooved or perforated metal chucks, porous ceramics can provide uniform adsorption across the entire surface without localized depressions, greatly reducing the deformation and localized stress caused by thin wafers/wafers being “sucked into