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In ceramic machining, one of the most common questions we discuss with customers is: “Can this corner be made as a sharp 90-degree angle?” In most cases, the answer is no. Unlike metals, ceramics cannot reliably maintain sharp corners. Instead, corners should be designed with chamfers (C) or fillets (R). Understanding why this is necessary—and

Silicon carbide ceramics are widely used in semiconductor, high-temperature, and corrosive industrial environments. Among them, Reaction-Bonded Silicon Carbide (SiSiC) and Pressureless Sintered Silicon Carbide (SSiC) represent two fundamentally different material systems. Although both are based on SiC, their composition, microstructure, performance limits, and cost structure differ significantly.  Material Composition SiSiC (Reaction-Bonded Silicon Carbide) SiSiC is

Aluminum nitride (AlN) ceramics are widely used in electronics, aerospace, and industrial applications due to their exceptional thermal conductivity, electrical insulation, and dimensional stability. Precision AlN ceramic parts offer tailored solutions for industries requiring tight tolerances and reliable performance. Why Precision Aluminum Nitride Ceramic Parts Matter High-precision AlN components address multiple engineering challenges: Thermal management:

Alumina ceramic etching rings are consumable but critical components in plasma etching systems. They control plasma distribution, shield chamber hardware, and reduce contamination near the wafer edge. One of our clients, an ICP plasma etching equipment manufacturer, contacted us due to edge erosion and particle alarm issues. Our solution was to upgrade the alumina purity

Frankly speaking, in the five years we’ve been working in the field of technical ceramics, over 60% of our products serve the semiconductor industry. Among these, the most supplied materials are undoubtedly alumina, aluminum nitride, silicon carbide, zerodur, and fused silica. These materials are commonly used in critical stages of semiconductor manufacturing, such as wafer

To obtain defect-free fused silica precision parts, it is necessary to master appropriate processing methods and equipment. As the preferred material for aerospace, semiconductors, and optics, quartz possesses an ultra-low coefficient of thermal expansion, excellent optical transparency, and good chemical resistance. The following points will help you understand how to precision machine quartz glass parts.

Although quartz and sapphire are both transparent and colorless glass and look very similar, they differ fundamentally in their physical properties, optical properties, and practical applications. This article will systematically compare quartz glass and sapphire glass from several key dimensions. Material Composition Quartz glass is an amorphous material with consistent properties in all directions; sapphire

Low CTE ceramics refer to advanced ceramic materials with a low coefficient of thermal expansion (CTE), meaning they undergo minimal dimensional change when exposed to temperature variations. This property is critical in high-precision and high-stability applications where thermal mismatch can cause stress, misalignment, or failure. Compared with metals and polymers, low CTE ceramic materials offer

Showerhead, also known as a gas distribution plate or gas shower plate, is a gas distribution component used in semiconductor processes such as PVD, CVD, and etching. Its core function is to uniformly distribute process gases into the reaction chamber, enabling high-quality thin film deposition, etching, or plasma reactions, thereby improving production efficiency and product

Silicon nitride ceramics (Si₃N₄) are renowned for their outstanding hardness, fracture toughness, and thermal shock resistance. These properties also make the machining of silicon nitride far more challenging than that of common ceramic materials. Even slight mishandling can lead to chipping, cracks, and other defects, seriously affecting dimensional accuracy. Such outcomes are unacceptable for applications