窒化アルミニウムウェハーキャリア
窒化アルミニウムウェハーキャリアは、半導体装置(蒸着、エッチング、熱処理など)の工程でウェハーを搬送するためのキャリアです。静電吸着技術によりウェハを固定し、ウェハの反りや変形を防止します。一般的なものは、一般的な12インチ300mmのAlN(窒化アルミニウム)ウエハーキャリアサイズとカスタマイズされたAINです。
窒化アルミニウムウェハーキャリアは、半導体装置(蒸着、エッチング、熱処理など)の工程でウェハーを搬送するためのキャリアです。静電吸着技術によりウェハを固定し、ウェハの反りや変形を防止します。一般的なものは、一般的な12インチ300mmのAlN(窒化アルミニウム)ウエハーキャリアサイズとカスタマイズされたAINです。
フリップチップボンダーは一般的な半導体パッケージング装置であり、その機能はチップを裏返して基板に直接接着することです。SiC真空チャックはフリップチップボンディングプロセスのために特別に設計され、真空圧を利用してウェハやチップをしっかりと吸着させます。次に、その具体的な役割を分析する。SiC真空チャックの役割
現在のウェーハ一括処理装置の中で、セントロサームのc.HORICOO300を例に挙げる。この装置は、日本のルネサスエレクトロニクスが山梨県に持つ300mmパワー半導体製造ラインで、主に酸化・アニール工程に使用されている。同装置は、8チューブクラスターデザインを採用し、全自動ウェハーおよびウェハーボート
Introduction In today’s industrial environment, electrical insulating ceramic materials are often used to protect various precision instruments and are widely used in engineering applications such as semiconductors and aerospace. In addition to high electrical insulation, ceramic materials also have excellent properties such as high thermal conductivity and high mechanical strength. Below I will list 5
In the modern precision optical field, the selection of low thermal expansion materials is particularly critical, such as the lenses of large optical telescopes and the optical components of laser gyroscopes. Zerodur or ULE Glass are both famous for their extremely low thermal expansion coefficients. So how do you choose which material to use as
Definition Machinable glass ceramics is a special polycrystalline material. Unlike the familiar ceramics that are sintered by powder, it is formed by melting and quenching to form glass. Its machinability comes from the fact that the crystals in the microstructure allow crack deflection and will not cause failure due to local fractures, so it can
What is Ceramic Mud Pump Liner Ceramic mud pump liner is the inner tube of the pump cylinder, which is in direct contact with the mud in drilling applications. It is usually made of (alumina ceramic or zirconia ceramic). Ceramic materials have become the mainstream choice due to their unique mechanical properties and wear resistance.
In current semiconductor devices, heat dissipation and insulation have always been unavoidable issues. In fact, beryllium oxide has been used in semiconductor device substrates, radio frequency devices, etc. as early as the 1950s and 1960s. With the advancement of technology, after 2000, aluminum nitride began to gradually replace beryllium oxide as the preferred material in
Material Zirconia Density 6.02g/cm³ Roughness Ra0.01um Maximum size 800*500mm DATASHEET Custom zirconia ceramic is very common in many engineering projects. There are two types of zirconia, namely magnesium stabilized zirconia and Yttria Stabilized Zirconia. In terms of performance, Zro2 has the highest fracture toughness and excellent wear resistance among ceramic materials. At the same time,
Material Silicon Carbide Vickers hardness 2650(Hu0.5) Roughness Ra0.01um Maximum size Φ450mm DATASHEET Custom silicon carbide ceramic are widely used in today’s industrial field. Whether for wear-resistant parts or high-temperature components, they exhibit outstanding performance. This is due to SiC’s high hardness, low friction coefficient, and stability across a wide temperature range. Particularly in the automotive