Flip-Chip Bonder is a common semiconductor packaging equipment, its function is to flip the chip over and bond it directly to the substrate. SiC Vacuum Chucks are specially designed for flip chip bonding process, using vacuum pressure to firmly absorb the wafer or chip. Next, I will analyze its specific role.
Role of SiC Vacuum Chucks in Flip-Chip Bonder Systems
1. Workpiece Holding
No need to use traditional physical clamping, which can avoid damage to the workpiece, eliminate slippage and achieve high-precision positioning
2. Thermal Management
SiC ceramics can effectively dissipate heat, have good dimensional stability, help conduct heat, and maintain uniform heating (please refer to our introduction to silicon carbide for details)
Why SiC for Vacuum Chucks?
- Withstands 1000°C high temperature without deformation while maintaining dimensional stability
- SiC chucks have high thermal conductivity of 120–200 W/m·K
- SiC ceramics have high mechanical strength and hardness
- SiC materials have good resistance to industrial chemicals (such as flux, cleaning agents)
SiC Vacuum Chuck Machining
We are a professional superhard material processing manufacturer, we can customize SiC Vacuum Chuck, provide circular, rectangular or complex geometric shapes of ceramic material machining (support 5-axis machining)
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