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Flip-Chip Bonder is a common semiconductor packaging equipment, its function is to flip the chip over and bond it directly to the substrate. SiC Vacuum Chucks are specially designed for flip chip bonding process, using vacuum pressure to firmly absorb the wafer or chip. Next, I will analyze its specific role. Role of SiC Vacuum

Among today’s wafer batch processing equipment, take centrotherm’s c.HORICOO300 as an example. This equipment is used by Renesas Electronics of Japan in its 300mm power semiconductor production line in Yamanashi Prefecture, mainly for oxidation and annealing processes. The system adopts an 8-tube cluster design and is equipped with a fully automatic wafer and wafer boat

Introduction In today’s industrial environment, electrical insulating ceramic materials are often used to protect various precision instruments and are widely used in engineering applications such as semiconductors and aerospace. In addition to high electrical insulation, ceramic materials also have excellent properties such as high thermal conductivity and high mechanical strength. Below I will list 5

In the modern precision optical field, the selection of low thermal expansion materials is particularly critical, such as the lenses of large optical telescopes and the optical components of laser gyroscopes. Zerodur or ULE Glass are both famous for their extremely low thermal expansion coefficients. So how do you choose which material to use as

Definition Machinable glass ceramics is a special polycrystalline material. Unlike the familiar ceramics that are sintered by powder, it is formed by melting and quenching to form glass. Its machinability comes from the fact that the crystals in the microstructure allow crack deflection and will not cause failure due to local fractures, so it can

What is Ceramic Mud Pump Liner Ceramic mud pump liner is the inner tube of the pump cylinder, which is in direct contact with the mud in drilling applications. It is usually made of (alumina ceramic or zirconia ceramic). Ceramic materials have become the mainstream choice due to their unique mechanical properties and wear resistance.

In current semiconductor devices, heat dissipation and insulation have always been unavoidable issues. In fact, beryllium oxide has been used in semiconductor device substrates, radio frequency devices, etc. as early as the 1950s and 1960s. With the advancement of technology, after 2000, aluminum nitride began to gradually replace beryllium oxide as the preferred material in

Material Zirconia Density 6.02g/cm³ Roughness Ra0.01um Maximum size 800*500mm DATASHEET Custom zirconia ceramic is very common in many engineering projects. There are two types of zirconia, namely magnesium stabilized zirconia and Yttria Stabilized Zirconia. In terms of performance, Zro2 has the highest fracture toughness and excellent wear resistance among ceramic materials. At the same time,

Material Silicon Carbide Vickers hardness 2650(Hu0.5) Roughness Ra0.01um Maximum size Φ450mm DATASHEET Custom silicon carbide ceramic are widely used in today’s industrial field. Whether for wear-resistant parts or high-temperature components, they exhibit outstanding performance. This is due to SiC’s high hardness, low friction coefficient, and stability across a wide temperature range. Particularly in the automotive

Ultra-Low Expansion ULE Glass produced by Corning has a lower CTE coefficient than Schott’s Zerodur glass, and does not require crystallization. It is also very good at adapting to temperature changes, avoiding deformation or stress caused by thermal expansion and contraction, and ensuring stability in high-precision applications (laser resonant cavity, astronomical telescope, atomic clock resonant