Aluminum Nitride (AlN) Ceramics Manufacturers and Suppliers

Leading aluminum nitride (AlN) ceramic manufacturers include CoorsTek, Kyocera, Tokuyama (SHAPAL™), MARUWA, and Jundro Ceramics Technology. These companies provide AlN substrates, heat sinks, and custom components widely used in semiconductors, power electronics, aerospace, and medical devices. AlN ceramics typically achieve thermal conductivity between 170–200 W/m·K, combined with excellent electrical insulation (>10¹³ Ω·cm) and high-temperature stability, making them essential for high-performance applications.

Key Manufacturers & Product Capabilities

ManufacturerKey ProductsThermal ConductivityApplicationsDistinct Features
CoorsTekCustom AlN parts, substrates170–180 W/m·KElectronics, aerospace100+ years ceramics expertise
Tokuyama (SHAPAL™)Machinable AlN~90 W/m·KSemiconductor toolsEasy to machine, halogen plasma resistant
KyoceraAlN substrates & components170–200 W/m·KPower modules, RFMass production capability
MARUWAHigh-purity AlN filler & substrates160–180 W/m·KLED, IC packagingProprietary powder & sintering
Jundro Ceramic TechnologyPrecision-machined AlN parts170–185 W/m·KSemiconductor, defense, medicalCustom machining ±0.001 mm
Precision CeramicsAlN plates, PCAN1000170 W/m·KThermal managementSilicon-matched CTE
Ortech CeramicsSubstrates, crucibles160–170 W/m·KIndustrial, electronicsISO-certified custom production
Nextgen Advanced MaterialsAlN single crystal substrates180–200 W/m·KAdvanced electronicsNiche R&D applications

Common Applications of Aluminum Nitride Ceramics

  • Semiconductors: Wafer chucks, heat spreaders, backplates requiring matched thermal expansion with silicon.

  • Power Electronics: Substrates for MOSFETs, IGBTs, and LED modules due to high thermal conductivity and insulation.

  • Microwave & RF: Low-loss substrates for aerospace and defense communication systems.

  • Medical Devices: High-frequency surgical instruments requiring thermal management and biocompatibility.

  • High-Temperature Components: Crucibles and refractory parts with resistance to thermal shock and chemical corrosion.


 

Technical Highlights

  • Thermal conductivity: 170–200 W/m·K (depending on purity and sintering)

  • Electrical resistivity: >10¹³ Ω·cm

  • CTE (Coefficient of Thermal Expansion): ~4.5 × 10⁻⁶/K (close to silicon)

  • Dielectric strength: 15–18 kV/mm


Frequently Asked Questions (FAQ)